CVE-2023-33063: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
· high severity · unattributed attribution
Evidence and provenance
- Original source
- CISA KEV report ↗
- Published
- 2023-12-05T00:00:00Z
- Confidence basis
- No actor match
- Record ID
70e65994071ca1033bec
Vulnerabilities
CVE-2023-33063
Use and citation
Verify the original report before making operational decisions. Cite this permanent page together with the original source, publication date, confidence level, and review status.